ON Semiconductor FDMS8320LDC

FDMS8320LDC ON Semiconductor
FDMS8320LDC
FDMS8320LDC
ET14519379
ON Semiconductor

Product Information

Maximum Continuous Drain Current:
192 A
Transistor Material:
Si
Width:
5.85mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
40 V
Package Type:
Power 56
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
121 nC @ 10 V
Channel Type:
N
Length:
5.1mm
Pin Count:
8
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
125 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
1.05mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
1.7 mΩ
Manufacturer Standard Lead Time:
34 Weeks
Detailed Description:
N-Channel 40V 44A (Ta), 130A (Tc) 3.2W (Ta), 125W (Tc) Surface Mount Dual Cool™56
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-PowerTDFN
Base Part Number:
FDMS83
Gate Charge (Qg) (Max) @ Vgs:
170nC @ 10V
Rds On (Max) @ Id, Vgs:
1.1mOhm @ 44A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
40V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
11635pF @ 20V
Mounting Type:
Surface Mount
Series:
Dual Cool™, PowerTrench®
Supplier Device Package:
Dual Cool™56
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
44A (Ta), 130A (Tc)
Customer Reference:
Power Dissipation (Max):
3.2W (Ta), 125W (Tc)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDMS8320LDC. While 192 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 5.85mm wide. The product offers single transistor configuration. It has a maximum of 40 v drain source voltage. The package is a sort of power 56. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 1v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 121 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 5.1mm. It contains 8 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 125 w maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -20 v, +20 v. In addition, the height is 1.05mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 1.7 mω maximum drain source resistance. It has typical 34 weeks of manufacturer standard lead time. It features n-channel 40v 44a (ta), 130a (tc) 3.2w (ta), 125w (tc) surface mount dual cool™56. The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 8-powertdfn. Base Part Number: fdms83. The maximum gate charge and given voltages include 170nc @ 10v. It has a maximum Rds On and voltage of 1.1mohm @ 44a, 10v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The on semiconductor's product offers user-desired applications. The product has a 40v drain to source voltage. The maximum Vgs rate is ±20v. The product's input capacitance at maximum includes 11635pf @ 20v. The product dual cool™, powertrench®, is a highly preferred choice for users. dual cool™56 is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 44a (ta), 130a (tc). The product carries maximum power dissipation 3.2w (ta), 125w (tc). This product use mosfet (metal oxide) technology.

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FDMS8320LDC, N-Channel Dual Cool 56 Power Trench MOSFET 40V 192A 1.1mOhm(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Mult Dev Wire Conversion 21/Nov/2017(PCN Assembly/Origin)
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Mult Dev Material/Assembly Chg 20/Mar/2018(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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FDMS8320LDC(Datasheets)
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Mult Devices 24/Oct/2017(PCN Packaging)

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