Dimensions:
3.3 x 3.3 x 0.72mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
40 W
Height:
0.72mm
Width:
3.3mm
Length:
3.3mm
Package Type:
MLP 3.3 x 3.3
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
Maximum Operating Temperature:
+150 °C
Pin Count:
8
Manufacturer Standard Lead Time:
49 Weeks
Detailed Description:
P-Channel 150V 2A (Ta), 8.4A (Tc) 2.3W (Ta), 40W (Tc) Surface Mount 8-MLP (3.3x3.3)
Vgs(th) (Max) @ Id:
4V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-PowerWDFN
Base Part Number:
FDMC86262
Gate Charge (Qg) (Max) @ Vgs:
13nC @ 10V
Rds On (Max) @ Id, Vgs:
307mOhm @ 2A, 10V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
150V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
885pF @ 75V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
8-MLP (3.3x3.3)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
2A (Ta), 8.4A (Tc)
Customer Reference:
Power Dissipation (Max):
2.3W (Ta), 40W (Tc)
Technology:
MOSFET (Metal Oxide)
