ON Semiconductor FDM6296

ON Semiconductor

Product Information

Detailed Description:
N-Channel 30V 11.5A (Ta) 2.1W (Ta) Surface Mount 8-Power33 (3x3)
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-PowerVDFN
Base Part Number:
FDM629
Gate Charge (Qg) (Max) @ Vgs:
17nC @ 5V
Rds On (Max) @ Id, Vgs:
10.5mOhm @ 11.5A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
30V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2005pF @ 15V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
8-Power33 (3x3)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
11.5A (Ta)
Customer Reference:
Power Dissipation (Max):
2.1W (Ta)
Technology:
MOSFET (Metal Oxide)
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This is manufactured by ON Semiconductor. The manufacturer part number is FDM6296. It features n-channel 30v 11.5a (ta) 2.1w (ta) surface mount 8-power33 (3x3). The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 8-powervdfn. Base Part Number: fdm629. The maximum gate charge and given voltages include 17nc @ 5v. It has a maximum Rds On and voltage of 10.5mohm @ 11.5a, 10v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The on semiconductor's product offers user-desired applications. The product has a 30v drain to source voltage. The maximum Vgs rate is ±20v. The product's input capacitance at maximum includes 2005pf @ 15v. The product is available in surface mount configuration. The product powertrench®, is a highly preferred choice for users. 8-power33 (3x3) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 11.5a (ta). The product carries maximum power dissipation 2.1w (ta). This product use mosfet (metal oxide) technology.

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FDM6296(Datasheets)
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Mold Compound 17/March/2008(PCN Design/Specification)

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