Dimensions:
4.9 x 3.9 x 1.58mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
1.6 (Single) W, 2 (Dual) W
Height:
1.58mm
Width:
3.9mm
Length:
4.9mm
Package Type:
SOIC
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
Maximum Operating Temperature:
+150 °C
Pin Count:
8
FET Feature:
Schottky Diode (Isolated)
Manufacturer Standard Lead Time:
50 Weeks
Detailed Description:
P-Channel 60V 3A (Ta) 900mW (Ta) Surface Mount 8-SOIC
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Base Part Number:
FDFS2P106
Gate Charge (Qg) (Max) @ Vgs:
21nC @ 10V
Rds On (Max) @ Id, Vgs:
110mOhm @ 3A, 10V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
60V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
714pF @ 30V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
8-SOIC
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
3A (Ta)
Customer Reference:
Power Dissipation (Max):
900mW (Ta)
Technology:
MOSFET (Metal Oxide)
