ON Semiconductor FDFMA3P029Z

FDFMA3P029Z ON Semiconductor
ON Semiconductor

Product Information

FET Feature:
Schottky Diode (Isolated)
Base Part Number:
FDFMA3
Detailed Description:
P-Channel 30V 3.3A (Ta) 1.4W (Ta) Surface Mount 6-MicroFET (2x2)
Input Capacitance (Ciss) (Max) @ Vds:
435pF @ 15V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
3V @ 250µA
Series:
PowerTrench®
Gate Charge (Qg) (Max) @ Vgs:
10nC @ 10V
Rds On (Max) @ Id, Vgs:
87mOhm @ 3.3A, 10V
Supplier Device Package:
6-MicroFET (2x2)
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
P-Channel
Customer Reference:
Package / Case:
6-VDFN Exposed Pad
Power Dissipation (Max):
1.4W (Ta)
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
3.3A (Ta)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
ON Semiconductor
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This is manufactured by ON Semiconductor. The manufacturer part number is FDFMA3P029Z. The FET features of the product include schottky diode (isolated). Base Part Number: fdfma3. It features p-channel 30v 3.3a (ta) 1.4w (ta) surface mount 6-microfet (2x2). The product's input capacitance at maximum includes 435pf @ 15v. The product is available in surface mount configuration. The typical Vgs (th) (max) of the product is 3v @ 250µa. The product powertrench®, is a highly preferred choice for users. The maximum gate charge and given voltages include 10nc @ 10v. It has a maximum Rds On and voltage of 87mohm @ 3.3a, 10v. 6-microfet (2x2) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type p-channel. Moreover, the product comes in 6-vdfn exposed pad. The product carries maximum power dissipation 1.4w (ta). The product has a 30v drain to source voltage. The continuous current drain at 25°C is 3.3a (ta). This product use mosfet (metal oxide) technology. The on semiconductor's product offers user-desired applications.

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FDFMA3P029Z(Datasheets)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)

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