Dimensions:
6.73 x 6.22 x 2.39mm
Maximum Continuous Drain Current:
66 A
Transistor Material:
Si
Width:
6.22mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
30 V
Package Type:
DPAK (TO-252)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1V
Maximum Operating Temperature:
+175 °C
Typical Gate Charge @ Vgs:
16 nC @ 5 V
Channel Type:
N
Typical Input Capacitance @ Vds:
1755 pF @ 15 V
Length:
6.73mm
Pin Count:
3
Typical Turn-Off Delay Time:
29 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
63 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
2.39mm
Typical Turn-On Delay Time:
11 ns
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
13 mΩ
Manufacturer Standard Lead Time:
9 Weeks
Detailed Description:
N-Channel 30V 15A (Ta), 66A (Tc) 3.2W (Ta), 63W (Tc) Surface Mount TO-252AA
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
TO-252-3, DPak (2 Leads + Tab), SC-63
Base Part Number:
FDD6670
Gate Charge (Qg) (Max) @ Vgs:
22nC @ 5V
Rds On (Max) @ Id, Vgs:
8mOhm @ 15A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
30V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1755pF @ 15V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
TO-252AA
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
15A (Ta), 66A (Tc)
Customer Reference:
Power Dissipation (Max):
3.2W (Ta), 63W (Tc)
Technology:
MOSFET (Metal Oxide)
