ON Semiconductor FDC608PZ

FDC608PZ ON Semiconductor
FDC608PZ
FDC608PZ
ON Semiconductor

Product Information

Maximum Continuous Drain Current:
5.8 A
Transistor Material:
Si
Width:
1.7mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
20 V
Package Type:
SOT-23
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
0.4V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
17 nC @ 4.5 V
Channel Type:
P
Length:
3mm
Pin Count:
6
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
1.6 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-12 V, +12 V
Height:
1mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
43 mΩ
Manufacturer Standard Lead Time:
13 Weeks
Detailed Description:
P-Channel 20V 5.8A (Ta) 1.6W (Ta) Surface Mount SuperSOT™-6
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
SOT-23-6 Thin, TSOT-23-6
Base Part Number:
FDC608
Gate Charge (Qg) (Max) @ Vgs:
23nC @ 4.5V
Rds On (Max) @ Id, Vgs:
30mOhm @ 5.8A, 4.5V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
1330pF @ 10V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
SuperSOT™-6
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
5.8A (Ta)
Customer Reference:
Power Dissipation (Max):
1.6W (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDC608PZ. While 5.8 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 1.7mm wide. The product offers single transistor configuration. It has a maximum of 20 v drain source voltage. The package is a sort of sot-23. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 0.4v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 17 nc @ 4.5 v. The product is available in [Cannel Type] channel. Its accurate length is 3mm. It contains 6 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 1.6 w maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -12 v, +12 v. In addition, the height is 1mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 43 mω maximum drain source resistance. It has typical 13 weeks of manufacturer standard lead time. It features p-channel 20v 5.8a (ta) 1.6w (ta) surface mount supersot™-6. The typical Vgs (th) (max) of the product is 1.5v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in sot-23-6 thin, tsot-23-6. Base Part Number: fdc608. The maximum gate charge and given voltages include 23nc @ 4.5v. It has a maximum Rds On and voltage of 30mohm @ 5.8a, 4.5v. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 2.5v, 4.5v. The on semiconductor's product offers user-desired applications. The product has a 20v drain to source voltage. The maximum Vgs rate is ±12v. The product's input capacitance at maximum includes 1330pf @ 10v. The product powertrench®, is a highly preferred choice for users. supersot™-6 is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 5.8a (ta). The product carries maximum power dissipation 1.6w (ta). This product use mosfet (metal oxide) technology.

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FDC608PZ, PowerTrench -20V P-Channel 2.5V Specified MOSFET(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Mult Dev Assembly/Test Chg 30/Apr/2019(PCN Assembly/Origin)
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FDC608PZ(Datasheets)
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FDC6x, NDC7003P Die 11/May/2007(PCN Design/Specification)
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Mold Compound 08/April/2008(PCN Design/Specification)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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