Category:
Power MOSFET
Dimensions:
10.67 x 9.65 x 4.83mm
Maximum Continuous Drain Current:
27 A
Transistor Material:
Si
Width:
9.65mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
150 V
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
2V
Maximum Operating Temperature:
+175 °C
Typical Gate Charge @ Vgs:
14.3 nC @ 10 V
Channel Type:
N
Typical Input Capacitance @ Vds:
965 pF @ 75 V
Length:
10.67mm
Pin Count:
3
Typical Turn-Off Delay Time:
20 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
75 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
4.83mm
Typical Turn-On Delay Time:
10 ns
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
33.5 Ω
Manufacturer Standard Lead Time:
9 Weeks
Detailed Description:
N-Channel 150V 27A (Tc) 75W (Tc) Surface Mount D²PAK
Vgs(th) (Max) @ Id:
4V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Base Part Number:
FDB390
Gate Charge (Qg) (Max) @ Vgs:
18.6nC @ 10V
Rds On (Max) @ Id, Vgs:
39mOhm @ 27A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
150V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1285pF @ 75V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
D²PAK
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
27A (Tc)
Customer Reference:
Power Dissipation (Max):
75W (Tc)
Technology:
MOSFET (Metal Oxide)
