Category:
Power MOSFET
Dimensions:
10.67 x 9.65 x 4.83mm
Maximum Continuous Drain Current:
20 A
Transistor Material:
Si
Width:
9.65mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
600 V
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
3V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
75 nC @ 10 V
Channel Type:
N
Typical Input Capacitance @ Vds:
2370 pF@ 25 V
Length:
10.67mm
Pin Count:
3
Typical Turn-Off Delay Time:
230 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
208 W
Series:
SuperFET
Maximum Gate Source Voltage:
-30 V, +30 V
Height:
4.83mm
Typical Turn-On Delay Time:
62 ns
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
190 mΩ
Manufacturer Standard Lead Time:
8 Weeks
Detailed Description:
N-Channel 600V 20A (Tc) 208W (Tc) Surface Mount D²PAK
Vgs(th) (Max) @ Id:
5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Base Part Number:
FCB20
Gate Charge (Qg) (Max) @ Vgs:
98nC @ 10V
Rds On (Max) @ Id, Vgs:
190mOhm @ 10A, 10V
FET Type:
N-Channel
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
600V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
3080pF @ 25V
Mounting Type:
Surface Mount
Series:
SuperFET™
Supplier Device Package:
D²PAK
Drive Voltage (Max Rds On, Min Rds On):
10V
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
20A (Tc)
Customer Reference:
Power Dissipation (Max):
208W (Tc)
Technology:
MOSFET (Metal Oxide)
