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This is manufactured by ON Semiconductor. The manufacturer part number is BS170-D26Z. The given dimensions of the product include 5.2 x 4.19 x 5.33mm. The product is available in through hole configuration. Provides up to 350 mw maximum power dissipation. In addition, the height is 5.33mm. Furthermore, the product is 4.19mm wide. Its accurate length is 5.2mm. The package is a sort of to-92. It consists of 1 elements per chip. Whereas, the minimum operating temperature of the product is -55 °c. It has a maximum operating temperature of +150 °c. It contains 3 pins. Base Part Number: bs170. It features n-channel 60v 500ma (ta) 830mw (ta) through hole to-92-3. The product's input capacitance at maximum includes 40pf @ 10v. The typical Vgs (th) (max) of the product is 3v @ 1ma. The product has a 60v drain to source voltage. The maximum Vgs rate is ±20v. The drive voltage (maximum and minimum Rds On) of the product includes 10v. It has a maximum Rds On and voltage of 5ohm @ 200ma, 10v. to-92-3 is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type n-channel. Moreover, the product comes in to-226-3, to-92-3 (to-226aa) (formed leads). The product carries maximum power dissipation 830mw (ta). The continuous current drain at 25°C is 500ma (ta). This product use mosfet (metal oxide) technology. The on semiconductor's product offers user-desired applications.
For more information please check the datasheets.
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