Fairchild/ON Semiconductor FDN359BN_F095

FDN359BN_F095 Fairchild/ON Semiconductor
Fairchild/ON Semiconductor

Product Information

Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-236-3, SC-59, SOT-23-3
Gate Charge (Qg) (Max) @ Vgs:
7nC @ 5V
Rds On (Max) @ Id, Vgs:
46 mOhm @ 2.7A, 10V
FET Type:
N-Channel
Standard Package:
1
Manufacturer:
Fairchild/ON Semiconductor
Drain to Source Voltage (Vdss):
30V
Vgs (Max):
±20V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Input Capacitance (Ciss) (Max) @ Vds:
650pF @ 15V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
SuperSOT-3
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
2.7A (Ta)
Power Dissipation (Max):
500mW (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
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This is manufactured by Fairchild/ON Semiconductor. The manufacturer part number is FDN359BN_F095. The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-236-3, sc-59, sot-23-3. The maximum gate charge and given voltages include 7nc @ 5v. It has a maximum Rds On and voltage of 46 mohm @ 2.7a, 10v. It carries FET type n-channel. It is available in the standard package of 1. The fairchild/on semiconductor's product offers user-desired applications. The product has a 30v drain to source voltage. The maximum Vgs rate is ±20v. Its typical moisture sensitivity level is 1 (unlimited). The product's input capacitance at maximum includes 650pf @ 15v. The product is available in surface mount configuration. The product powertrench®, is a highly preferred choice for users. supersot-3 is the supplier device package value. The minimum and maximum Rds On drive voltage includes [Drive Voltage (Max Rds On, Min Rds On)]. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 2.7a (ta). The product carries maximum power dissipation 500mw (ta). This product use mosfet (metal oxide) technology.

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Mold Compound 08/April/2008(PCN Design/Specification)
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Wire Bonding 07/Nov/2008(PCN Design/Specification)
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Molded Pkg, SUPERSOT, 3 Lead Drawing(Datasheets)
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FDN359BN(Datasheets)
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Status Chg 22/Feb/2017(PCN Part Status Change)
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1342 (UK2011-EN PDF)(Catalog Page)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)

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