ON Semiconductor FDG6316P

FDG6316P ON Semiconductor
FDG6316P
FDG6316P
ON Semiconductor

Product Information

Maximum Continuous Drain Current:
700 mA
Transistor Material:
Si
Width:
1.25mm
Transistor Configuration:
Isolated
Maximum Drain Source Voltage:
12 V
Package Type:
SOT-363 (SC-70)
Number of Elements per Chip:
2
Minimum Gate Threshold Voltage:
0.4V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
1.7 nC @ 4.5 V
Channel Type:
P
Length:
2mm
Pin Count:
6
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
300 mW
Series:
PowerTrench
Maximum Gate Source Voltage:
-8 V, +8 V
Height:
1mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
650 mΩ
FET Feature:
Logic Level Gate
Base Part Number:
FDG6316
Detailed Description:
Mosfet Array 2 P-Channel (Dual) 12V 700mA 300mW Surface Mount SC-88 (SC-70-6)
Input Capacitance (Ciss) (Max) @ Vds:
146pF @ 6V
Gate Charge (Qg) (Max) @ Vgs:
2.4nC @ 4.5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Series:
PowerTrench®
Package / Case:
6-TSSOP, SC-88, SOT-363
Rds On (Max) @ Id, Vgs:
270mOhm @ 700mA, 4.5V
Supplier Device Package:
SC-88 (SC-70-6)
Manufacturer Standard Lead Time:
51 Weeks
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
2 P-Channel (Dual)
Customer Reference:
Power - Max:
300mW
Drain to Source Voltage (Vdss):
12V
Current - Continuous Drain (Id) @ 25°C:
700mA
Manufacturer:
ON Semiconductor
RoHs Compliant
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This is manufactured by ON Semiconductor. The manufacturer part number is FDG6316P. While 700 ma of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 1.25mm wide. The product offers isolated transistor configuration. It has a maximum of 12 v drain source voltage. The package is a sort of sot-363 (sc-70). It consists of 2 elements per chip. Whereas its minimum gate threshold voltage includes 0.4v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 1.7 nc @ 4.5 v. The product is available in [Cannel Type] channel. Its accurate length is 2mm. It contains 6 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 300 mw maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -8 v, +8 v. In addition, the height is 1mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 650 mω maximum drain source resistance. The FET features of the product include logic level gate. Base Part Number: fdg6316. It features mosfet array 2 p-channel (dual) 12v 700ma 300mw surface mount sc-88 (sc-70-6). The product's input capacitance at maximum includes 146pf @ 6v. The maximum gate charge and given voltages include 2.4nc @ 4.5v. The typical Vgs (th) (max) of the product is 1.5v @ 250µa. The product powertrench®, is a highly preferred choice for users. Moreover, the product comes in 6-tssop, sc-88, sot-363. It has a maximum Rds On and voltage of 270mohm @ 700ma, 4.5v. sc-88 (sc-70-6) is the supplier device package value. It has typical 51 weeks of manufacturer standard lead time. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type 2 p-channel (dual). The maximum power of the product is 300mw. The product has a 12v drain to source voltage. The continuous current drain at 25°C is 700ma. The on semiconductor's product offers user-desired applications.

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ESD Control Selection Guide V1(Technical Reference)
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FDG6316P, Dual P-Channel 1.8V Specified PowerTrench MOSFET SC-70 6-Pin(Technical Reference)
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Wafer Fab 02/Aug/2020(PCN Assembly/Origin)
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Mold Compound 12/Dec/2007(PCN Design/Specification)
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Mold Compound 07/May/2008(PCN Design/Specification)
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FDG6316P(Datasheets)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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You are welcome to Enrgtech for online shopping, so exceptional in supplying electrical and electronic innovative ON Semiconductor FDG6316P and the best services all around the world ET14518914. We value our customers in assisting them to choose an excellent Transistors - FETs, MOSFETs - Arrays, which leads them to achieve their goals. The metal–oxide–semiconductor field-effect transistor, ON Semiconductor FDG6316P, also known as the metal–oxide–silicon transistor, is a form of insulated-gate field-effect transistor made by controlling the oxidation of a semiconductor from a leading brand known as ON Semiconductor, commonly silicon.

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