onsemi NSS60600MZ4T3G

NSS60600MZ4T3G onsemi
onsemi

Product Information

Current - Collector (Ic) (Max):
6 A
HTSUS:
8541.21.0075
RoHS Status:
ROHS3 Compliant
Voltage - Collector Emitter Breakdown (Max):
60 V
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-261-4, TO-261AA
DC Current Gain (hFE) (Min) @ Ic, Vce:
120 @ 1A, 2V
edacadModel:
NSS60600MZ4T3G Models
Frequency - Transition:
100MHz
Vce Saturation (Max) @ Ib, Ic:
350mV @ 600mA, 6A
REACH Status:
REACH Unaffected
edacadModelUrl:
/en/models/1792927
Transistor Type:
PNP
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
14 Weeks
Current - Collector Cutoff (Max):
100nA (ICBO)
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
SOT-223 (TO-261)
Power - Max:
800 mW
Base Product Number:
NSS60600
ECCN:
EAR99
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This is manufactured by onsemi. The manufacturer part number is NSS60600MZ4T3G. The maximum collector current includes 6 a. It is assigned with possible HTSUS value of 8541.21.0075. The product is rohs3 compliant. The maximum collector emitter breakdown voltage of the product is 60 v. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-261-4, to-261aa. Furthermore, 120 @ 1a, 2v is the minimum DC current gain at given voltage. The transition frequency of the product is 100mhz. The 350mv @ 600ma, 6a is the maximum Vce saturation. In addition, it is reach unaffected. The transistor is a pnp type. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). It has a long 14 weeks standard lead time. In addition, 100na (icbo) is the maximum current at collector cutoff. The product is available in surface mount configuration. sot-223 (to-261) is the supplier device package value. The maximum power of the product is 800 mw. Moreover, it corresponds to nss60600, a base product number of the product. The product is designated with the ear99 code number.

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onsemi RoHS(Environmental Information)
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onsemi REACH(Environmental Information)
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Mult Dev Assembly 27/Jul/2020(PCN Assembly/Origin)
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Wire Bond 01/Dec/2010(PCN Design/Specification)
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NSS60600MZ4T1G(Datasheets)
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Covering Tape/Material Chg 20/May/2016(PCN Packaging)

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FAQs

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