Microchip Technology DN3765K4-G

DN3765K4-G Microchip Technology
Microchip Technology

Product Information

FET Feature:
Depletion Mode
Base Part Number:
DN3765
Detailed Description:
N-Channel 650V 300mA (Tj) 2.5W (Ta) Surface Mount TO-252-3
Input Capacitance (Ciss) (Max) @ Vds:
825pF @ 25V
Mounting Type:
Surface Mount
Rds On (Max) @ Id, Vgs:
8Ohm @ 150mA, 0V
Drain to Source Voltage (Vdss):
650V
Vgs (Max):
±20V
Drive Voltage (Max Rds On, Min Rds On):
0V
Supplier Device Package:
TO-252-3
Manufacturer Standard Lead Time:
7 Weeks
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
N-Channel
Customer Reference:
Package / Case:
TO-252-3, DPak (2 Leads + Tab), SC-63
Power Dissipation (Max):
2.5W (Ta)
Current - Continuous Drain (Id) @ 25°C:
300mA (Tj)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
Microchip Technology
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This is manufactured by Microchip Technology. The manufacturer part number is DN3765K4-G. The FET features of the product include depletion mode. Base Part Number: dn3765. It features n-channel 650v 300ma (tj) 2.5w (ta) surface mount to-252-3. The product's input capacitance at maximum includes 825pf @ 25v. The product is available in surface mount configuration. It has a maximum Rds On and voltage of 8ohm @ 150ma, 0v. The product has a 650v drain to source voltage. The maximum Vgs rate is ±20v. The drive voltage (maximum and minimum Rds On) of the product includes 0v. to-252-3 is the supplier device package value. It has typical 7 weeks of manufacturer standard lead time. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type n-channel. Moreover, the product comes in to-252-3, dpak (2 leads + tab), sc-63. The product carries maximum power dissipation 2.5w (ta). The continuous current drain at 25°C is 300ma (tj). This product use mosfet (metal oxide) technology. The microchip technology's product offers user-desired applications.

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DN3765(Datasheets)
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MBB/Label Chgs 16/Nov/2018(PCN Packaging)

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