STMicroelectronics STB26NM60N

STB26NM60N STMicroelectronics
STB26NM60N
STB26NM60N
STMicroelectronics

Product Information

Maximum Continuous Drain Current:
20 A
Transistor Material:
Si
Width:
10.4mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
600 V
Maximum Gate Threshold Voltage:
4V
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
2V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
60 nC @ 10 V
Channel Type:
N
Length:
10.75mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
140 W
Series:
MDmesh
Maximum Gate Source Voltage:
-25 V, +25 V
Height:
4.6mm
Maximum Drain Source Resistance:
165 mΩ
FET Feature:
-
HTSUS:
8541.29.0095
RoHS Status:
ROHS3 Compliant
Operating Temperature:
150°C (TJ)
Package / Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Rds On (Max) @ Id, Vgs:
165mOhm @ 10A, 10V
title:
STB26NM60N
Vgs(th) (Max) @ Id:
4V @ 250µA
REACH Status:
REACH Unaffected
edacadModel:
STB26NM60N Models
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
edacadModelUrl:
/en/models/2346293
Drain to Source Voltage (Vdss):
600 V
Vgs (Max):
±30V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
140W (Tc)
standardLeadTime:
14 Weeks
Input Capacitance (Ciss) (Max) @ Vds:
1800 pF @ 50 V
Mounting Type:
Surface Mount
Series:
MDmesh™ II
Gate Charge (Qg) (Max) @ Vgs:
60 nC @ 10 V
Supplier Device Package:
TO-263 (D2PAK)
Packaging:
Tape & Reel (TR)
Current - Continuous Drain (Id) @ 25°C:
20A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
STB26
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is manufactured by STMicroelectronics. The manufacturer part number is STB26NM60N. While 20 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 10.4mm wide. The product offers single transistor configuration. It has a maximum of 600 v drain source voltage. The product carries 4v of maximum gate threshold voltage. The package is a sort of d2pak (to-263). It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 2v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 60 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 10.75mm. It contains 3 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 140 w maximum power dissipation. The product mdmesh, is a highly preferred choice for users. It features a maximum gate source voltage of -25 v, +25 v. In addition, the height is 4.6mm. It provides up to 165 mω maximum drain source resistance. It is assigned with possible HTSUS value of 8541.29.0095. The product is rohs3 compliant. The product has 150°c (tj) operating temperature range. Moreover, the product comes in to-263-3, d2pak (2 leads + tab), to-263ab. It has a maximum Rds On and voltage of 165mohm @ 10a, 10v. The typical Vgs (th) (max) of the product is 4v @ 250µa. In addition, it is reach unaffected. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 10v. The product has a 600 v drain to source voltage. The maximum Vgs rate is ±30v. Its typical moisture sensitivity level is 1 (unlimited). The product carries maximum power dissipation 140w (tc). It has a long 14 weeks standard lead time. The product's input capacitance at maximum includes 1800 pf @ 50 v. The product mdmesh™ ii, is a highly preferred choice for users. The maximum gate charge and given voltages include 60 nc @ 10 v. to-263 (d2pak) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. The continuous current drain at 25°C is 20a (tc). This product use mosfet (metal oxide) technology. Moreover, it corresponds to stb26, a base product number of the product. The product is designated with the ear99 code number.

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N-channel 600 V, 0.135 Ohm, 20 A MDmesh(TM) II Power MOSFET D2PAK(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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IPG-PWR/14/8603 21/Jul/2014(PCN Assembly/Origin)
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IPG-PWR/14/8422 11/Apr/2014(PCN Design/Specification)
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D2PAK Lead Modification 04/Oct/2013(PCN Design/Specification)
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STB,F,P, W26NM60N(Datasheets)
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Carrier tape design improvement 05/Mar/2024(PCN Packaging)
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Mult Dev Inner Box Chg 9/Dec/2021(PCN Packaging)

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