Panjit International Inc. PCDD0465G1_L2_00001
Product Information
HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Reverse Recovery Time (trr):
0 ns
Operating Temperature - Junction:
-55°C ~ 175°C
REACH Status:
REACH Unaffected
Current - Average Rectified (Io):
4A
Speed:
No Recovery Time > 500mA (Io)
Voltage - Forward (Vf) (Max) @ If:
1.7 V @ 4 A
Package:
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max):
650 V
Capacitance @ Vr, F:
146pF @ 1V, 1MHz
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
11 Weeks
Current - Reverse Leakage @ Vr:
40 µA @ 650 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
TO-252AA
Technology:
SiC (Silicon Carbide) Schottky
Base Product Number:
PCDD0465
ECCN:
EAR99
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Yes. We ship PCDD0465G1_L2_00001 Internationally to many countries around the world.
This is manufactured by Panjit International Inc.. The manufacturer part number is PCDD0465G1_L2_00001. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in to-252-3, dpak (2 leads + tab), sc-63. It has a trr (reverse recovery time) of 0 ns. The product operate at temperatures ranging from -55°c ~ 175°c. In addition, it is reach unaffected. It features a 4a of average rectified current. It has a robust speed of no recovery time > 500ma (io). The product has a maximum forward voltage of 1.7 v @ 4 a. It is shipped in tape & reel (tr) package . While it has maximum reverse voltage of 650 v. Moreover, the product has a 146pf @ 1v, 1mhz capacitance. Its typical moisture sensitivity level is 1 (unlimited). It has a long 11 weeks standard lead time. 40 µa @ 650 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. to-252aa is the supplier device package value. This product use sic (silicon carbide) schottky technology. Moreover, it corresponds to pcdd0465, a base product number of the product. The product is designated with the ear99 code number.
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