Cypress Semiconductor Corp S34MS01G204BHA010

S34MS01G204BHA010 Cypress Semiconductor Corp
Cypress Semiconductor Corp

Product Information

HTSUS:
8542.32.0071
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Memory Interface:
Parallel
Write Cycle Time - Word, Page:
45ns
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
1Gbit
Package / Case:
63-VFBGA
REACH Status:
REACH Unaffected
Memory Organization:
64M x 16
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Access Time:
45 ns
Mounting Type:
Surface Mount
Series:
MS-2
Supplier Device Package:
63-BGA (11x9)
Memory Type:
Non-Volatile
Voltage - Supply:
1.7V ~ 1.95V
ECCN:
3A991B1A
Technology:
FLASH - NAND
Base Product Number:
S34MS01
Memory Format:
FLASH
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This is manufactured by Cypress Semiconductor Corp. The manufacturer part number is S34MS01G204BHA010. It is assigned with possible HTSUS value of 8542.32.0071. The product is rohs3 compliant. It is a parallel memory interface. It allows a 45ns of write cycle time. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 1gbit. Moreover, the product comes in 63-vfbga. In addition, it is reach unaffected. While the product's memory is organised as 64m x 16. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It allows 45 ns access time. The product is available in surface mount configuration. The product ms-2, is a highly preferred choice for users. 63-bga (11x9) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 1.7v ~ 1.95v. The product is designated with the 3a991b1a code number. This product use flash - nand technology. Moreover, it corresponds to s34ms01, a base product number of the product. It is a sort of flash memory.

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Mult Devices 01/Apr/2019(PCN Other)
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Die Epoxy Chg 05/Nov/2015(PCN Design/Specification)
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Mult Device Serial No Mark 26/Sep/2017(PCN Design/Specification)
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S34MS01/2/4G2(UNKNOWN TYPE)
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Date Code/Shelf Life Chgs 18/Jul/2019(PCN Packaging)
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Mult Devices 19/Jul/2017(PCN Packaging)

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FAQs

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