Microchip Technology 23LC512T-I/SN

23LC512T-I-SN Microchip Technology 23LC512T-I/SN
Microchip Technology

Product Information

HTSUS:
8542.32.0041
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Memory Interface:
SPI - Quad I/O
Write Cycle Time - Word, Page:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
512Kbit
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
REACH Status:
REACH Unaffected
edacadModel:
23LC512T-I/SN Models
edacadModelUrl:
/en/models/3597513
Memory Organization:
64K x 8
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Clock Frequency:
20 MHz
standardLeadTime:
5 Weeks
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Memory Type:
Volatile
Voltage - Supply:
2.5V ~ 5.5V
ECCN:
EAR99
Technology:
SRAM
Base Product Number:
23LC512
Memory Format:
SRAM
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This is manufactured by Microchip Technology. The manufacturer part number is 23LC512T-I/SN. It is assigned with possible HTSUS value of 8542.32.0041. The product is rohs3 compliant. It is a spi - quad i/o memory interface. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 512kbit. Moreover, the product comes in 8-soic (0.154", 3.90mm width). In addition, tape & reel (tr) is the available packaging type of the product. In addition, it is reach unaffected. While the product's memory is organised as 64k x 8. Its typical moisture sensitivity level is 1 (unlimited). The product boasts a clock frequency of 20 mhz. It has a long 5 weeks standard lead time. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a type of volatile memory type. It has optimum voltage supply of 2.5v ~ 5.5v. The product is designated with the ear99 code number. This product use sram technology. Moreover, it corresponds to 23lc512, a base product number of the product. It is a sort of sram memory.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Assembly Site Addition 08/Apr/2015(PCN Assembly/Origin)
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Die/Moulding Material Chg 21/Jun/2016(PCN Design/Specification)
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23A512/23LC512 10/May/2022(PCN Design/Specification)
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Serial Memory Brochure(Datasheets)
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23A512, 23LC512(Datasheets)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)
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Reel Design Update 07/May/2015(PCN Packaging)

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FAQs

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