ON Semiconductor FSA8108BUCX

FSA8108BUCX ON Semiconductor
FSA8108BUCX
FSA8108BUCX
ET14523426
ET14523426
Interface - Specialized
Interface - Specialized
ON Semiconductor

Product Information

Dimensions:
1.56 x 1.16 x 0.378mm
Mounting Type:
Surface Mount
Power Supply Type:
Single
Typical Single Supply Voltage:
2.7 → 4.5 V
Height:
0.378mm
Width:
1.16mm
Length:
1.56mm
Package Type:
CSP
Minimum Operating Temperature:
-40 °C
Maximum Operating Temperature:
+85 °C
Pin Count:
12
Base Part Number:
FSA81
Detailed Description:
Cell Phone Interface 12-WLCSP (1.16x1.56)
Mounting Type:
Surface Mount
Supplier Device Package:
12-WLCSP (1.16x1.56)
Packaging:
Cut Tape (CT)
Applications:
Cell Phone
Voltage - Supply:
2.7V ~ 4.5V
Customer Reference:
Package / Case:
12-UFBGA, WLCSP
Manufacturer:
ON Semiconductor
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FSA8108BUCX. The given dimensions of the product include 1.56 x 1.16 x 0.378mm. The product is available in surface mount configuration. It is a type of single power supply. It has a typical single supply voltage of 2.7 → 4.5 v. In addition, the height is 0.378mm. Furthermore, the product is 1.16mm wide. Its accurate length is 1.56mm. The package is a sort of csp. Whereas, the minimum operating temperature of the product is -40 °c. It has a maximum operating temperature of +85 °c. It contains 12 pins. Base Part Number: fsa81. It features cell phone interface 12-wlcsp (1.16x1.56). 12-wlcsp (1.16x1.56) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product is widely employed in cell phone. It has optimum voltage supply of 2.7v ~ 4.5v. Moreover, the product comes in 12-ufbga, wlcsp. The on semiconductor's product offers user-desired applications.

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FSA8108, Audio Jack Detection and Configuration Switch, Supports Volume Up/Down & Send/End Keys(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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3Q Mult Dev EOL 9/Nov/2017(PCN Obsolescence/ EOL)
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WLCSP Back-End Process Flow 22/Oct/2013(PCN Assembly/Origin)
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FSA8108 Limited Datasheet(Datasheets)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)

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