Texas Instruments TLE2072IP

TLE2072IP Texas Instruments
TLE2072IP
TLE2072IP
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
48 mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
8-DIP (0.300", 7.62mm)
Current - Input Bias:
1 pA
Voltage - Input Offset:
300 µV
Voltage - Supply Span (Max):
38 V
Voltage - Supply Span (Min):
4.5 V
REACH Status:
REACH Unaffected
Output Type:
-
edacadModel:
TLE2072IP Models
Current - Supply:
3.1mA (x2 Channels)
edacadModelUrl:
/en/models/1676868
Package:
Tube
Moisture Sensitivity Level (MSL):
Not Applicable
Slew Rate:
45V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
10 MHz
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
8-PDIP
Amplifier Type:
J-FET
Base Product Number:
TLE2072
ECCN:
EAR99
Checking for live stock

This is manufactured by Texas Instruments. The manufacturer part number is TLE2072IP. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 48 ma output or channel current. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 8-dip (0.300", 7.62mm). The typical current - input bias includes 1 pa. The input offset voltage is 300 µv. The maximum voltage supply span of the product is 38 v. While the minimum voltage supply is 4.5 v. In addition, it is reach unaffected. The current - supply of a bespoke product is 3.1ma (x2 channels). It is shipped in tube package . Its typical moisture sensitivity level is not applicable. The 45v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 10 mhz. The product is available in through hole configuration. 8-pdip is the supplier device package value. It is a sort of a j-fet amplifier. Moreover, it corresponds to tle2072, a base product number of the product. The product is designated with the ear99 code number.

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Material Set 30/Mar/2017(PCN Design/Specification)
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Mult Dev Assembly Wafer Fab Site/Design 22/Dec/2023(PCN Design/Specification)

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