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Texas Instruments LMC6041IMX/NOPB

LMC6041IMX-NOPB Texas Instruments LMC6041IMX/NOPB
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
0.002 pA
Voltage - Input Offset:
1 mV
Voltage - Supply Span (Max):
15.5 V
Voltage - Supply Span (Min):
4.5 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
LMC6041IMX/NOPB Models
Current - Supply:
18µA
edacadModelUrl:
/en/models/367392
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.02V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
1
Gain Bandwidth Product:
75 kHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
General Purpose
Base Product Number:
LMC6041
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMC6041IMX/NOPB. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 0.002 pa. The input offset voltage is 1 mv. The maximum voltage supply span of the product is 15.5 v. While the minimum voltage supply is 4.5 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 18µa. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 0.02v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 1 circuits. The gain bandwidth product is 75 khz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to lmc6041, a base product number of the product. The product is designated with the ear99 code number.

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Mult Devices Wafer Fab Site 09/Mar/2017(PCN Assembly/Origin)
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Mold Compound 24/Mar/2016(PCN Design/Specification)

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