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United Kingdom
The MG Chemicals 8349TFM is a two-part, flame-retardant epoxy adhesive formulated for solid bonding heat sinks, power semiconductors, LEDs, and other thermally sensitive components in electronic assemblies. Supplied in a 1:1 mix ratio cartridge, this dark-grey paste cures to a hard, durable polymer that combines reliable electrical insulation with solid thermal conduction, making it ideal for demanding industrial, power-electronics, and high-reliability applications.
The 8349TFM adhesive is engineered to deliver stable thermal performance while ensuring electrical isolation, making it highly suitable for heat-sink-to-component bonds where both thermal conductivity and dielectric strength are important. The high-dimensional stability and robust polymer matrix protect against thermal cycling, mechanical stress and environmental factors common in industrial and power-electronics environments. Whether deployed in multi-board systems, LED arrays or power-module enclosures, its performance supports reliability and longevity.
For more information please check the datasheets.
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