Fotomechanix

FR4 Eurocard & Other Sizes FR4 substrates for normal applications Board thickness 1.6 mm Copper thickness 35 μm Type Fotoboard FR4 Base Material Epoxy glass fabric laminate Foil Laminate High purity electro-deposited copper Dielectric Constant. 4.7 @ 1MHz Dissipation Factor 0.019 @ 1MHz Surface Resistance 4 x 10 12 Ω Volume Resistance 2 x 10 15 Ω cm Water Absorption >0.01% Solderbath Resistance Note Developer concentration: 25g/l of 690-849 or 6-10g/l of Sodium or Potassium Hydroxide. Conduct trials if in doubt. Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBs Standard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applications Where applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist. Photoresists/Pre-sensitised Boards

Copper-Clad Eurocard Epoxy Glass PCBs These 305g/m 2 (1oz/ft 2 ) copper-clad boards (thickness 1.6mm) are for producing PCBs Suitable etchant is ferric chloride solution Board thickness 1.6mm Note Board is not photoresist Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBs Standard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applications Where applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist. Photoresists/Pre-sensitised Boards

FR4 Eurocard & Other Sizes FR4 substrates for normal applications Board thickness 1.6 mm Copper thickness 35 μm Type Fotoboard FR4 Base Material Epoxy glass fabric laminate Foil Laminate High purity electro-deposited copper Dielectric Constant. 4.7 @ 1MHz Dissipation Factor 0.019 @ 1MHz Surface Resistance 4 x 10 12 Ω Volume Resistance 2 x 10 15 Ω cm Water Absorption >0.01% Solderbath Resistance Note Developer concentration: 25g/l of 690-849 or 6-10g/l of Sodium or Potassium Hydroxide. Conduct trials if in doubt. Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBs Standard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applications Where applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist. Photoresists/Pre-sensitised Boards

Copper-Clad Eurocard Epoxy Glass PCBs These 305g/m 2 (1oz/ft 2 ) copper-clad boards (thickness 1.6mm) are for producing PCBs Suitable etchant is ferric chloride solution Board thickness 1.6mm Note Board is not photoresist Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBs Standard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applications Where applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist. Photoresists/Pre-sensitised Boards