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Showing Results For: Array Capacitors
Array Capacitors
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New items
W4L14Z474MAT1S, AVX
Surface Mount 0306, W4L Series
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. All capacitors are highly reliable and excellent quality.
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New items
CKCA43C0G1H150K100AA, TDK
TDK SMT 1206 commercial grade array, CKC series
TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.
Features and Benefits:
Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package
Applications:
Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit
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Warning
Not Recommended for New Design
New items
CA064X102K2RACTU, KEMET
KEMET MLCC Array CA064 Series
KEMET Ceramic Chip Capacitor Array technology promotes reduced placement costs and throughput. The use of capacitor arrays saves board space which translates into more functions per board. These X7R dielectric Arrays feature a 125° maximum operating temperature.
X7R MLCC Exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance regarding ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C.Applications include those that can benefit from board saving areas such as telecommunications, computers, hand held devices and automotive.
Features
Superior flex performance (up to 5 mm)
-55°C to +125°C operating temperature range
Available capacitance tolerances of ±5%, ±10%, and ±20%
Saves both circuit board and inventory space
100% pure matte tin-plated termination finish allowing for excellent solderability
Standards
AEC–Q200
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W2A41A560K4T2A, AVX
Surface Mount 0508, W2A Series
Two or four capacitors of the same value on one array
Less than 50% board space of equivalent discrete capacitors
Saves placement cost and substrate space
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New items
CA064X103K2RACTU, KEMET
KEMET MLCC Array CA064 Series
KEMET Ceramic Chip Capacitor Array technology promotes reduced placement costs and throughput. The use of capacitor arrays saves board space which translates into more functions per board. These X7R dielectric Arrays feature a 125° maximum operating temperature.
X7R MLCC Exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance regarding ambient temperature. Capacitance change is limited to ±15% from -55°C to +125°C.Applications include those that can benefit from board saving areas such as telecommunications, computers, hand held devices and automotive.
Features
Superior flex performance (up to 5 mm)
-55°C to +125°C operating temperature range
Available capacitance tolerances of ±5%, ±10%, and ±20%
Saves both circuit board and inventory space
100% pure matte tin-plated termination finish allowing for excellent solderability
Standards
AEC–Q200
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New items
W3A4YC104M4T2A, AVX
Surface Mount 0612, W3A Series
Two or four capacitors of the same value on one array
Less than 50% board space of equivalent discrete capacitors
Saves placement cost and substrate space
Technical specification
Dimensions (L x W x H) (mm)
Operating Temperature (°C)
3.2 x 1.6 x 1.35
-55 to +125
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New items
W2A45C103KAT2A, AVX
Surface Mount 0508, W2A Series
Two or four capacitors of the same value on one array
Less than 50% board space of equivalent discrete capacitors
Saves placement cost and substrate space
Network and Feed-through
New items
CKCA43C0G1H681K100AA, TDK
TDK SMT 1206 commercial grade array, CKC series
TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.
Features and Benefits:
Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package
Applications:
Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit
Network and Feed-through
Warning
Not Recommended for New Design
New items
W3A45C332KAT2A, AVX
Surface Mount 0612, W3A Series
Two or four capacitors of the same value on one array
Less than 50% board space of equivalent discrete capacitors
Saves placement cost and substrate space
Technical specification
Dimensions (L x W x H) (mm)
Operating Temperature (°C)
3.2 x 1.6 x 1.35
-55 to +125
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New items
CA0612KRX7R9BB102, EPCOS
Surface Mount 0612, 4-C Array
Four capacitors (4 x 0603) of the same value on one array
Less than 50% board space of equivalent discrete capacitors
Applications include high density consumer electronics and automotive
Dimensions (L x W x H) (mm)
Operating Temperature (°C)
3.2 x 1.6 x 1.22
-55 to +125
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New items
CA0612KRX7R9BB102, Phycomp
Surface Mount 0612, 4-C Array
Four capacitors (4 x 0603) of the same value on one array
Less than 50% board space of equivalent discrete capacitors
Applications include high density consumer electronics and automotive
Dimensions (L x W x H) (mm)
Operating Temperature (°C)
3.2 x 1.6 x 1.22
-55 to +125
Network and Feed-through
New items
CKCA43C0G1H101K100AA, TDK
TDK SMT 1206 commercial grade array, CKC series
TDK Multilayer Ceramic Chip Capacitors CKC Series 4 in 1 Array, CKCL44 and CKCA43 types.
Features and Benefits:
Multiple 4 in 1 array of multilayer ceramic chip capacitors in a single product, contributing to reduced installation costs
The electrostatic capacity range and shape are designed to meet the demands of the cellular phone market
Unique electrode construction reduces crosstalk within the package
Applications:
Cellular telephone interface
Interface cable circuit
PC and peripherals
CPU bus line
High frequency circuit
Noise bypass circuit
Network and Feed-through