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Texas Instruments CSD16406Q3

CSD16406Q3 Texas Instruments
CSD16406Q3
CSD16406Q3
ET10864297
Texas Instruments

Product Information

Maximum Continuous Drain Current:
79 A
Transistor Material:
Si
Width:
3.4mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
25 V
Maximum Gate Threshold Voltage:
2.2V
Package Type:
SON
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1.4V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
5.8 nC @ 4.5 V
Channel Type:
N
Length:
3.4mm
Pin Count:
8
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
46 W
Series:
NexFET
Maximum Gate Source Voltage:
-12 V, +16 V
Height:
1.1mm
Minimum Operating Temperature:
-55 °C
Forward Diode Voltage:
1V
Maximum Drain Source Resistance:
7.4 mΩ
Manufacturer Standard Lead Time:
20 Weeks
Detailed Description:
N-Channel 25V 19A (Ta), 60A (Tc) 2.7W (Ta) Surface Mount 8-VSON-CLIP (3.3x3.3)
Vgs(th) (Max) @ Id:
2.2V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-PowerTDFN
Base Part Number:
CSD16406
Gate Charge (Qg) (Max) @ Vgs:
8.1nC @ 4.5V
Rds On (Max) @ Id, Vgs:
5.3mOhm @ 20A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
Texas Instruments
Drain to Source Voltage (Vdss):
25V
Vgs (Max):
+16V, -12V
Input Capacitance (Ciss) (Max) @ Vds:
1100pF @ 12.5V
Mounting Type:
Surface Mount
Series:
NexFET™
Supplier Device Package:
8-VSON-CLIP (3.3x3.3)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
19A (Ta), 60A (Tc)
Customer Reference:
Power Dissipation (Max):
2.7W (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by Texas Instruments. The manufacturer part number is CSD16406Q3. While 79 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 3.4mm wide. The product offers single transistor configuration. It has a maximum of 25 v drain source voltage. The product carries 2.2v of maximum gate threshold voltage. The package is a sort of son. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 1.4v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 5.8 nc @ 4.5 v. The product is available in [Cannel Type] channel. Its accurate length is 3.4mm. It contains 8 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 46 w maximum power dissipation. The product nexfet, is a highly preferred choice for users. It features a maximum gate source voltage of -12 v, +16 v. In addition, the height is 1.1mm. Whereas, the minimum operating temperature of the product is -55 °c. Its forward diode voltage is 1v . It provides up to 7.4 mω maximum drain source resistance. It has typical 20 weeks of manufacturer standard lead time. It features n-channel 25v 19a (ta), 60a (tc) 2.7w (ta) surface mount 8-vson-clip (3.3x3.3). The typical Vgs (th) (max) of the product is 2.2v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 8-powertdfn. Base Part Number: csd16406. The maximum gate charge and given voltages include 8.1nc @ 4.5v. It has a maximum Rds On and voltage of 5.3mohm @ 20a, 10v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The texas instruments's product offers user-desired applications. The product has a 25v drain to source voltage. The maximum Vgs rate is +16v, -12v. The product's input capacitance at maximum includes 1100pf @ 12.5v. The product nexfet™, is a highly preferred choice for users. 8-vson-clip (3.3x3.3) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 19a (ta), 60a (tc). The product carries maximum power dissipation 2.7w (ta). This product use mosfet (metal oxide) technology.

pdf icon
ESD Control Selection Guide V1(Technical Reference)
pdf icon
Qualification Wire Bond 27/May/2014(PCN Assembly/Origin)
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Qualification Revision A 01/Jul/2014(PCN Design/Specification)

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