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NXP USA Inc. 1PS226,135

1PS226-135 NXP USA Inc. 1PS226,135
NXP USA Inc.

Product Information

HTSUS:
8541.10.0070
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-236-3, SC-59, SOT-23-3
Diode Configuration:
1 Pair Series Connection
Operating Temperature - Junction:
150°C (Max)
REACH Status:
REACH Unaffected
Reverse Recovery Time (trr):
4 ns
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
1.2 V @ 100 mA
Package:
Tape & Reel (TR)
Voltage - DC Reverse (Vr) (Max):
80 V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Average Rectified (Io) (per Diode):
215mA (DC)
Current - Reverse Leakage @ Vr:
500 nA @ 80 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
SMT3; MPAK
Technology:
Standard
Base Product Number:
1PS22
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is 1PS226,135. It is assigned with possible HTSUS value of 8541.10.0070. The product is rohs3 compliant. Moreover, the product comes in to-236-3, sc-59, sot-23-3. The diode features a 1 pair series connection configuration. The product operate at temperatures ranging from 150°c (max). In addition, it is reach unaffected. It has a trr (reverse recovery time) of 4 ns. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 1.2 v @ 100 ma. It is shipped in tape & reel (tr) package . While it has maximum reverse voltage of 80 v. Its typical moisture sensitivity level is 1 (unlimited). The average rectified current at per diode is 215ma (dc). 500 na @ 80 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. smt3; mpak is the supplier device package value. This product use standard technology. Moreover, it corresponds to 1ps22, a base product number of the product. The product is designated with the ear99 code number.

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Multiple Devices 30/Jun/2009(PCN Obsolescence/ EOL)
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1PS226(Datasheets)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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