Texas Instruments SN74LVC8T245PW, Bus Transceiver, 8-Bit Non-Inverting LVTTL, 1.65 → 5.5 V, 24-Pin TSSOP

Enrgtech Part No: ET13907030
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Manufacturer Part No:
SN74LVC8T245PW
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Manufacturer: Texas Instruments

SN74LVC8T245PW Texas Instruments , Bus Transceiver, 8-Bit Non-Inverting LVTTL, 1.65 → 5.5 V, 24-Pin TSSOP

Product Information

Number of Channels per Chip:

Logic Function:

Bus Transceiver

Logic Family:

LVC

Output Level:

3-State

Package Type:

TSSOP

Pin Count:

HTSUS:

8542.39.0001

RoHS Status:

ROHS3 Compliant

Operating Temperature:

-40°C ~ 85°C (TA)

Input Type:

Package / Case:

24-TSSOP (0.173", 4.40mm Width)

Number of Bits per Element:

Checking for live stock

Texas Instruments SN74LVC8T245PW is a high-speed 8-bit dual‑supply bus transceiver in a compact TSSOP‑24 package. Built for bidirectional voltage-level translation between voltage domains (from 1.65 V to 5.5 V), it delivers reliable performance for modern mixed-voltage systems. It outperforms generic translators by combining Ti's heritage reliability with practical features demanded by engineers in telecom, industrial control, and embedded system design.

Product Unique Features

Voltage Translation Range: 1.65 V to 5.5 V on both VCCA and VCCB rails.
Channels / Data Width: 8‑bit non‑inverting bus transceiver.
Output Current (High/Low): 32 mA each.
Logic Outputs: 3‑state outputs, supports partial‑power‑down with Ioff to prevent back‑flow currents.
Propagation Delay: ~4.2 ns, supporting data‑rates up to 500 Mb/s.
Operating Temp: –40 °C to +85 °C.
Package: 24‑pin TSSOP (Surface Mount).
Protection Properties: Partial‑power‑down (Ioff), VCC isolation (Hi‑Z when either rail is GND), high ESD immunity, latch‑up resistance.

What Benefits Does It Offer to Users?

Robust Voltage-Level Translation: Seamlessly connects different voltage domains, ideal for mixed-voltage systems, IoT modules, or interface buffers.
High-Drive Capability & Speed: 32 mA drive per direction and sub-5 ns delay ensure crisp signal integrity for fast bus communication.
Protected and Reliable Design: Partial power-down features support, VCC isolation, and strong ESD/latch-up resilience, making it ideal for harsh industrial or telecom environments.
Compact and Efficient Package: TSSOP‑24 footprint saves board space for dense PCBs and embedded designs.

SN74LVC8T245(Datasheets)

Mult PN PART MARKING 08/Dec/2023(PCN Design/Specification)

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