Maximum Peak Pulse Current:
16A
Maximum Reverse Stand-off Voltage:
3.3V
Dimensions:
0.66 x 0.36 x 0.28mm
Mounting Type:
Surface Mount
Capacitance:
20pF
Maximum Reverse Leakage Current:
100nA
Maximum Operating Temperature:
+150 °C
Minimum Breakdown Voltage:
4.4V
Direction Type:
Bi-Directional
Height:
0.28mm
Width:
0.36mm
Length:
0.66mm
Package Type:
X3-DFN0201
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
ESD Protection:
Yes
Maximum Clamping Voltage:
8V
Diode Configuration:
Single
Pin Count:
2
Test Current:
1mA
Manufacturer Standard Lead Time:
8 Weeks
Base Part Number:
ESDM3031
Detailed Description:
8V Clamp 11A (8/20µs) Ipp Tvs Diode Surface Mount 2-X3DFN (0.62x0.32)
Mounting Type:
Surface Mount
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Clamping (Max) @ Ipp:
8V
Supplier Device Package:
2-X3DFN (0.62x0.32)
Voltage - Breakdown (Min):
4.4V
Packaging:
Cut Tape (CT)
Applications:
General Purpose
Operating Temperature:
-55°C ~ 150°C (TJ)
Capacitance @ Frequency:
20pF @ 1MHz (Max)
Customer Reference:
Package / Case:
0201 (0603 Metric)
Power Line Protection:
No
Bidirectional Channels:
1
Type:
Zener
Current - Peak Pulse (10/1000µs):
11A (8/20µs)
Manufacturer:
ON Semiconductor
