Dimensions:
10 x 9.2 x 4.5mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
90 W
Height:
4.5mm
Width:
9.2mm
Length:
10mm
Package Type:
TO-263
Number of Elements per Chip:
1
Maximum Operating Temperature:
+150 °C
Pin Count:
2 + Tab
Manufacturer Standard Lead Time:
48 Weeks
Base Part Number:
BBS3002
Detailed Description:
P-Channel 60V 100A (Ta) 90W (Tc) Surface Mount D²PAK (TO-263)
Input Capacitance (Ciss) (Max) @ Vds:
13200pF @ 20V
Drive Voltage (Max Rds On, Min Rds On):
4V, 10V
Mounting Type:
Surface Mount
Rds On (Max) @ Id, Vgs:
5.8mOhm @ 50A, 10V
Drain to Source Voltage (Vdss):
60V
Vgs (Max):
±20V
Gate Charge (Qg) (Max) @ Vgs:
280nC @ 10V
Supplier Device Package:
D²PAK (TO-263)
Packaging:
Cut Tape (CT)
Operating Temperature:
150°C (TJ)
FET Type:
P-Channel
Customer Reference:
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Power Dissipation (Max):
90W (Tc)
Current - Continuous Drain (Id) @ 25°C:
100A (Ta)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
ON Semiconductor
