Dimensions:
4.9 x 3.9 x 1.58mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
1.6 (Single) W, 2 (Dual) W
Height:
1.58mm
Width:
3.9mm
Length:
4.9mm
Package Type:
SOIC
Number of Elements per Chip:
2
Minimum Operating Temperature:
-55 °C
Maximum Operating Temperature:
+150 °C
Pin Count:
8
FET Feature:
Logic Level Gate
Base Part Number:
FDS68
Detailed Description:
Mosfet Array 2 P-Channel (Dual) 20V 6A 900mW Surface Mount 8-SOIC
Input Capacitance (Ciss) (Max) @ Vds:
2250pF @ 10V
Gate Charge (Qg) (Max) @ Vgs:
31nC @ 5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Series:
PowerTrench®
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Rds On (Max) @ Id, Vgs:
30mOhm @ 6A, 4.5V
Supplier Device Package:
8-SOIC
Manufacturer Standard Lead Time:
50 Weeks
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
2 P-Channel (Dual)
Customer Reference:
Power - Max:
900mW
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
6A
Manufacturer:
ON Semiconductor
