ON Semiconductor FDG6321C, Mosfet Array

ON Semiconductor

Product Information

Dimensions:
2.2 x 1.35 x 1mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
300 mW
Height:
1mm
Width:
1.35mm
Length:
2.2mm
Package Type:
SC-70
Number of Elements per Chip:
2
Minimum Operating Temperature:
-55 °C
Maximum Operating Temperature:
+150 °C
Pin Count:
6
FET Feature:
Logic Level Gate
Base Part Number:
FDG6321
Detailed Description:
Mosfet Array N and P-Channel 25V 500mA, 410mA 300mW Surface Mount SC-88 (SC-70-6)
Input Capacitance (Ciss) (Max) @ Vds:
50pF @ 10V
Gate Charge (Qg) (Max) @ Vgs:
2.3nC @ 4.5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Drain to Source Voltage (Vdss):
25V
Package / Case:
6-TSSOP, SC-88, SOT-363
Rds On (Max) @ Id, Vgs:
450mOhm @ 500mA, 4.5V
Supplier Device Package:
SC-88 (SC-70-6)
Manufacturer Standard Lead Time:
10 Weeks
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
N and P-Channel
Customer Reference:
Power - Max:
300mW
Current - Continuous Drain (Id) @ 25°C:
500mA, 410mA
Manufacturer:
ON Semiconductor
RoHs Compliant
Checking for live stock

The ON Semiconductor FDG6321C is a small MOSFET array designed for low-voltage, low-current switching applications. It is typically used in portable electronics, control circuits, and power-management sections where space is limited and efficiency matters. With a 25 V rating, it comfortably supports typical logic-level and signal-level switching tasks. This part is meant for practical circuit design, not high-power loads. It fits nicely where predictable behaviour and compact size are more important than raw current-handling capacity.

Electrical Characteristics of the ON Semiconductor FDG6321C Mosfet Array

The FDG6321C integrates multiple MOSFETs in a single package, simplifying board layouts and reducing component count. It supports continuous drain currents of up to 500 mA and 410 mA, with a total power dissipation of 300 mW under proper thermal conditions.

  • 25 V drain-source voltage rating.
  • Up to 500 mA / 410 mA current handling.
  • Low power dissipation for compact circuits.

Typical Uses of the Part

It is often used where switching accuracy and size matter more than high current capability.

  • Load switching in low-power circuits
  • Portable and battery-powered devices
  • Signal and control line switching
  • Compact power-management designs

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Datasheet FDG6321C(Technical Reference)
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Mult Dev Assembly/Test 9/Jan/2019(PCN Assembly/Origin)
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FDG6321C(Datasheets)
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Mold Compound 12/Dec/2007(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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