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The MBO SN96.5 AG3 CU0.5 RT15 is a lead-free solder wire designed for reliable electrical and electronic soldering. It provides predictable flow and solidification, helping reduce defects during assembly or repair work. This alloy composition is commonly used where lead-free compliance is required without sacrificing joint strength. It is supplied as a 1 mm wire, making it suitable for both manual soldering and controlled production environments.
This solder uses a tin-silver-copper (SAC) formulation that is widely accepted in modern electronics manufacturing. The alloy delivers stable wetting behaviour and consistent joint formation when used with compatible flux systems.
The 1 mm wire diameter works well for fine to medium solder joints, including PCB assembly and component repair. It feeds smoothly during hand soldering and allows better control over solder volume, reducing excess buildup.
It is suitable for technicians, production lines, and service environments that work to lead-free standards.
For more information please check the datasheets.
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