CHIPQUIK 15g Syringe Lead Free Solder Paste

The CHIPQUIK SMDLTLFP is a low-temperature, no-clean solder paste supplied in a 5cc/15 g syringe, specifically formulated for precision surface-mount and through-hole rework or production printing. The paste supports high-throughput applications and consistent print/dispense performance. Compatibility across standard stencil printing, enclosed dispensing, and no-clean residue processes makes it suitable for advanced electronics manufacturing and prototyping operations.

Unparalleled Benefits of Buying the CHIPQUIK 15g Syringe Lead Free Solder Paste

• 87% metal by weight maximises solder joint strength and reliability.
• T3 mesh particle size (25-45 µm) supports fine-pitch and BGA stencil printing.
• No-clean, REL0 classification flux minimises post-reflow cleaning.
• Wide stencil-life and 100 mm/s print-speed capability for high-volume operations.
• Syringe format with plunger/tip supports manual and automated dispensing.

Planned for Precision Electronics Manufacture

This solder paste is designed to meet the demands of modern PCB assembly, especially when component thermal sensitivity or low-temperature requirements exclude conventional solder alloys. The synthetic flux system ensures excellent wetting on a variety of board finishes, while clear residue and low voiding support high-reliability applications. Storage at 3-8 °C is recommended to maintain solderability, with a stated shelf-life of >6 months refrigerated.

Wide Application Range

• Low-temperature reflow of fine-pitch BGAs and QFNs on lead‐free boards.
• Prototype or small batch SMT assembly.
• Dispense or print processes in electronics rework and repair operations.
• Enclosed printing systems and automated production lines.
• Electronics manufacturing requiring no-clean residue and strong solder joints.

For more information please check the datasheets.