CHIPQUIK SMD291 10g Syringe Lead Free Solder Flux

The CHIPQUIK SMD291 is a tack‑flux paste supplied in a 10 g (10 cc) syringe, formulated for lead‑free and leaded rework, soldering, and BGA/flip‑chip assembly. It features a low‑viscosity, no‑clean synthetic vehicle that remains stable during handling and prevents unwanted flow across the PCB surface. The flux meets the REL0 flux classification and offers excellent wetting and clear residue performance for high‑precision electronics production. It is RoHS 3 and REACH compliant, providing a dependable tool for demanding SMT environments.

Core Features and Benefits of Choosing the CHIPQUIK 10g Syringe Lead Free Solder Flux

• Tack‑flux property prevents undesired spreading across the PCB.
• Compatible with both lead‑free and leaded soldering processes, broadening the application scope.
• Cartridge syringe design (10 cc/10 g) with plunger and tip enables accurate dispensing.
• Non‑corrosive, non‑conductive, no‑clean residuals simplify post‑assembly handling.
• Pleasant odour and light colour residue (light yellow to orange/brown) support user comfort and visual inspection.
• Long stencil life under controlled humidity and temperature conditions.

Engineered for Precision Electronics Assembly

The SMD291’s formulation is designed for high‑reliability environments where precise flux control and clean performance are critical. It activates at temperatures around 140 °C, enabling substantial wetting of solder joints, including BGAs, micro‑BGAs, and flip‑chip components. The syringe delivery allows selective application on high‑density PCBs, reducing the risk of bridging or contamination.

Applicable Areas of the Flux

• Rework and repair of SMT assemblies, including BGAs and flip‑chip modules.
• Precision dispensing on high‑density PCBs.
• Production lines transitioning between leaded and lead‑free soldering processes.
• Electronics manufacturing environments.
• R&D labs, prototyping and service centres.

For more information please check the datasheets.