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STMicroelectronics STD1HN60K3

STD1HN60K3 STMicroelectronics
STD1HN60K3
STD1HN60K3
STMicroelectronics

Product Information

Maximum Continuous Drain Current:
1.2 A
Transistor Material:
Si
Width:
6.2mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
600 V
Maximum Gate Threshold Voltage:
4.5V
Package Type:
DPAK (TO-252)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
2V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
9.5 nC @ 10 V
Channel Type:
N
Length:
6.6mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
27 W
Series:
MDmesh K3, SuperMESH3
Maximum Gate Source Voltage:
-30 V, +30 V
Height:
2.4mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
8 Ω
FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
4.5V @ 50µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-252-3, DPak (2 Leads + Tab), SC-63
Rds On (Max) @ Id, Vgs:
8Ohm @ 600mA, 10V
Gate Charge (Qg) (Max) @ Vgs:
9.5 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
600 V
Vgs (Max):
±30V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
27W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
140 pF @ 50 V
standardLeadTime:
16 Weeks
Mounting Type:
Surface Mount
Series:
SuperMESH3™
Supplier Device Package:
DPAK
Current - Continuous Drain (Id) @ 25°C:
1.2A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
STD1HN60
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is manufactured by STMicroelectronics. The manufacturer part number is STD1HN60K3. While 1.2 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 6.2mm wide. The product offers single transistor configuration. It has a maximum of 600 v drain source voltage. The product carries 4.5v of maximum gate threshold voltage. The package is a sort of dpak (to-252). It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 2v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 9.5 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 6.6mm. It contains 3 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 27 w maximum power dissipation. The product mdmesh k3, supermesh3, is a highly preferred choice for users. It features a maximum gate source voltage of -30 v, +30 v. In addition, the height is 2.4mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 8 ω maximum drain source resistance. It is assigned with possible HTSUS value of 8541.29.0095. The typical Vgs (th) (max) of the product is 4.5v @ 50µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-252-3, dpak (2 leads + tab), sc-63. It has a maximum Rds On and voltage of 8ohm @ 600ma, 10v. The maximum gate charge and given voltages include 9.5 nc @ 10 v. The product is rohs3 compliant. In addition, it is reach unaffected. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 10v. It is shipped in tape & reel (tr) package . The product has a 600 v drain to source voltage. The maximum Vgs rate is ±30v. Its typical moisture sensitivity level is 1 (unlimited). The product carries maximum power dissipation 27w (tc). The product's input capacitance at maximum includes 140 pf @ 50 v. It has a long 16 weeks standard lead time. The product supermesh3™, is a highly preferred choice for users. dpak is the supplier device package value. The continuous current drain at 25°C is 1.2a (tc). This product use mosfet (metal oxide) technology. Moreover, it corresponds to std1hn60, a base product number of the product. The product is designated with the ear99 code number.

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Power MOSFET N ch SuperMESH3 600V 1.2A Data Sheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Mult Devices Testing 10/May/2018(PCN Assembly/Origin)
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STD1HN60K3, STU1HN60K3(Datasheets)
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Box Label Chg 28/Jul/2016(PCN Packaging)
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Mult Dev Inner Box Chg 9/Dec/2021(PCN Packaging)

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