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United Kingdom
The Acc Silicones QSIL-553 is a high-performance silicone potting compound designed to encapsulate sensitive electronic components, providing environmental protection and superior heat dissipation. This two-part system cures to a soft, flexible silicone with a Shore A hardness of 32, effectively shielding components from shock, vibration, and moisture. Its key feature is its thermal conductivity of 0.68W/mK, allowing it to efficiently transfer heat away from critical electronics, thereby prolonging their operational lifespan and reliability across an exceptionally wide temperature range of -55°C to +260°C.
The QSIL-553 compound significantly improves the reliability and operational life of electronics by providing excellent protection against environmental factors and efficiently managing thermal stress. The material's flexibility prevents damage to delicate components during thermal cycling and shock.
For more information please check the datasheets.
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£ 0.000