Deliver to
United Kingdom
The 199-1468 is a high-performance epoxy potting compound formulated to provide durable protection for electronic assemblies. Designed for encapsulation, insulation, and environmental sealing, it safeguards delicate components from moisture, dust, vibration, and chemical exposure, ensuring long-term reliability and stability. Moreover, its low thermal expansion and consistent thermal conductivity make it suitable for encapsulating transformers, sensors, power modules, and PCBs where reliable heat dissipation is essential.
This semi-rigid epoxy system offers an ideal balance between strength and flexibility. Once cured, it creates a tough, protective layer that resists cracking and thermal stress, making it suitable for applications requiring mechanical support and thermal endurance. The compound maintains dimensional stability even under variable operating temperatures.
Engineered with high dielectric strength, the 199-1468 potting compound delivers outstanding electrical insulation performance, minimising the risk of short circuits or electrical leakage.
Formulated for practical use in manufacturing and repair settings, this epoxy offers controlled viscosity for precise application. It cures to a smooth, semi-rigid amber finish with outstanding adhesion to metals, plastics, and ceramics. The compound supports manual or automated dispensing, ensuring consistent quality across production runs.
For more information please check the datasheets.
I purchased the 199-1468 Potting Compound from EnrgTech, and it performed exceptionally well for my electronic applications. Delivery was smooth and on time, with clear tracking updates. The sales team was knowledgeable, ensuring I got the right material. Customer care was polite and helpful. EnrgTech’s professionalism and quality products make them one of the best suppliers I’ve worked with online.
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£ 0.000
