Texas Instruments TL103WAIDR

TL103WAIDR Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
40 mA
Operating Temperature:
-40°C ~ 105°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
20 nA
Voltage - Input Offset:
500 µV
Voltage - Supply Span (Max):
32 V
Voltage - Supply Span (Min):
3 V
REACH Status:
REACH Unaffected
Output Type:
-
edacadModel:
TL103WAIDR Models
Current - Supply:
700µA (x2 Channels)
edacadModelUrl:
/en/models/863694
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
0.4V/µs
standardLeadTime:
6 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
900 kHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Packaging:
Tape & Reel (TR)
Amplifier Type:
General Purpose
Base Product Number:
TL103
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TL103WAIDR. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 40 ma output or channel current. The product has -40°c ~ 105°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 20 na. The input offset voltage is 500 µv. The maximum voltage supply span of the product is 32 v. While the minimum voltage supply is 3 v. In addition, it is reach unaffected. The current - supply of a bespoke product is 700µa (x2 channels). Its typical moisture sensitivity level is 1 (unlimited). The 0.4v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 900 khz. The product is available in surface mount configuration. 8-soic is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. It is a sort of a general purpose amplifier. Moreover, it corresponds to tl103, a base product number of the product. The product is designated with the ear99 code number.

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Design 25/Feb/2022(PCN Design/Specification)
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Mult Dev Assembly Wafer Site/Design 22/Dec/2023(PCN Design/Specification)

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