Texas Instruments TLV342IDR

TLV342IDR Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.33.0001
RoHS Status:
ROHS3 Compliant
Current - Output / Channel:
115 mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Current - Input Bias:
1 pA
Voltage - Input Offset:
300 µV
Voltage - Supply Span (Max):
5.5 V
Voltage - Supply Span (Min):
1.5 V
REACH Status:
REACH Unaffected
Output Type:
Rail-to-Rail
edacadModel:
TLV342IDR Models
Current - Supply:
75µA (x2 Channels)
edacadModelUrl:
/en/models/1216734
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Slew Rate:
1V/µs
standardLeadTime:
12 Weeks
Number of Circuits:
2
Gain Bandwidth Product:
2.3 MHz
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Amplifier Type:
CMOS
Base Product Number:
TLV342
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is TLV342IDR. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 115 ma output or channel current. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-soic (0.154", 3.90mm width). The typical current - input bias includes 1 pa. The input offset voltage is 300 µv. The maximum voltage supply span of the product is 5.5 v. While the minimum voltage supply is 1.5 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 75µa (x2 channels). It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). The 1v/µs is the slew rate of the product. It has a long 12 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 2.3 mhz. The product is available in surface mount configuration. 8-soic is the supplier device package value. It is a sort of a cmos amplifier. Moreover, it corresponds to tlv342, a base product number of the product. The product is designated with the ear99 code number.

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Design 25/Feb/2022(PCN Design/Specification)
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Mult Dev Assembly Wafer Site/Design 22/Dec/2023(PCN Design/Specification)

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