This is manufactured by Texas Instruments. The manufacturer part number is TLV2372IP. While ±3 v, ±5 v is the typical dual supply voltage. Featuring a 39nv/√hz of typical input voltage noise density. Features 3mhz typical gain bandwidth. The given dimensions of the product include 9.81 x 6.35 x 4.57mm. The product is available in through hole configuration. Furthermore, it has a typical 2.4v/µs of slew rate. It is a type of dual, single power supply. It comprises 2 channels per chip. Rail to rail options include rail to rail input/output. In addition, the height is 4.57mm. It has a typical single supply voltage of 3 → 15 v. Furthermore, the product is 6.35mm wide. Its accurate length is 9.81mm. The package is a sort of pdip. Whereas, the minimum operating temperature of the product is -40 °c. It is a sort of a precision amplifier. Furthermore, its typical voltage gain includes 110 db. It has a maximum operating temperature of +125 °c. It contains 8 pins. It is assigned with possible HTSUS value of 8542.33.0001. The product is rohs3 compliant. It carries 16 ma output or channel current. The product has -40°c ~ 125°c (ta) operating temperature range. Moreover, the product comes in 8-dip (0.300", 7.62mm). The typical current - input bias includes 1 pa. The input offset voltage is 2 mv. The maximum voltage supply span of the product is 16 v. While the minimum voltage supply is 2.7 v. In addition, it is reach unaffected. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 750µa (x2 channels). It is shipped in tube package . Its typical moisture sensitivity level is not applicable. The 2.1v/µs is the slew rate of the product. It has a long 6 weeks standard lead time. It integrates 2 circuits. The gain bandwidth product is 3 mhz. 8-pdip is the supplier device package value. It is a sort of a general purpose amplifier. Moreover, it corresponds to tlv2372, a base product number of the product. The product is designated with the ear99 code number.
ESD Control Selection Guide V1(Technical Reference)
Assembly/Wafer Site 24/May/2023(PCN Assembly/Origin)
Material Set 30/Mar/2017(PCN Design/Specification)
TLV237x 14/Sep/2016(PCN Design/Specification)
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