Finish:
Black Anodised
Application:
Power PC, Heat Sink For IC, Cooler, Bga, SMD, PLCC, Microprocessor, PGA, Fan, Ic Processors
Material:
Aluminium
Height:
6.5mm
Width:
10 mm
Length:
10mm
Standards/Approvals:
No
Compatible Package Type:
PLCC, IC, SMD, BGA, DIL/IC, PGA
For Use With:
Universal Square Alu
Fastening:
Conductive Foil
Special Features:
Low Weight by Optimised Geometry, Effective Heat Dissipation by Optimum Fan Motor and Heatsink Design, Constant Heat Distribution in Base and Pins in Direction of Heat Flow, Low Current Consumption and Low Self-Heating, Other Operating Voltages on Request, Other Pin Lengths and Surfaces on Request, Adhesive Foil or Clamps, Double Ball Bearings for High Reliability and Long Product Life, Particularly Suited for Ball Grid Arrays, Components Fastened Using Glue, Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry, Customer-specific Modifications and Special Designs, High-grade Industrial Type, Compact Design With High Mechanical Stability, Heat Sink Dimensions Match Respective BGA Type, Available With Pulse Output and Alarm Device Circuit, Can Be Glued Directly on BGA Component
Product Type:
Heatsink
