Microsemi Corporation A2F500M3G-1FGG484

A2F500M3G-1FGG484 Microsemi Corporation
Microsemi Corporation

Product Information

Primary Attributes:
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Manufacturer:
Microsemi Corporation
Detailed Description:
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 100MHz 484-FPBGA (23x23)
Core Processor:
ARM® Cortex®-M3
Base Part Number:
A2F500M3G
Series:
SmartFusion®
Customer Reference:
Number of I/O:
MCU - 41, FPGA - 128
Supplier Device Package:
484-FPBGA (23x23)
Manufacturer Standard Lead Time:
12 Weeks
Packaging:
Tray
Connectivity:
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Operating Temperature:
0°C ~ 85°C (TJ)
Architecture:
MCU, FPGA
Package / Case:
484-BGA
Peripherals:
DMA, POR, WDT
RAM Size:
64KB
Speed:
100MHz
Flash Size:
512KB
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This is manufactured by Microsemi Corporation. The manufacturer part number is A2F500M3G-1FGG484. Primary Attributes of the Product: proasic®3 fpga, 500k gates, 11520 d-flip-flops. The microsemi corporation's product offers user-desired applications. It features arm® cortex®-m3 system on chip (soc) ic smartfusion® proasic®3 fpga, 500k gates, 11520 d-flip-flops 100mhz 484-fpbga (23x23). arm® cortex®-m3 is the product's core processor. Base Part Number: a2f500m3g. The product smartfusion®, is a highly preferred choice for users. mcu - 41, fpga - 128 is the I/O value of the product. 484-fpbga (23x23) is the supplier device package value. It has typical 12 weeks of manufacturer standard lead time. In addition, tray is the available packaging type of the product. It provides connectivity solutions through ebi/emi, ethernet, i²c, spi, uart/usart. The product has 0°c ~ 85°c (tj) operating temperature range. The product has been designed as mcu, fpga. Moreover, the product comes in 484-bga. It has supplied with other peripherals, such as dma, por, wdt. The product has typical 64kb RAM size. It has a robust speed of 100mhz. The product has 512kb flash size.

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Mult Dev Test Site 28/Feb/2019(PCN Assembly/Origin)
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Mult Dev Design Advisory 13/Oct/2017(PCN Design/Specification)
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Core/Halogen Free 17/May/2011(PCN Design/Specification)

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