This is manufactured by Microsemi Corporation. The manufacturer part number is A2F200M3F-FGG256I. Primary Attributes of the Product: proasic®3 fpga, 200k gates, 4608 d-flip-flops. The microsemi corporation's product offers user-desired applications. It features arm® cortex®-m3 system on chip (soc) ic smartfusion® proasic®3 fpga, 200k gates, 4608 d-flip-flops 80mhz 256-fpbga (17x17). arm® cortex®-m3 is the product's core processor. Base Part Number: a2f200. The product smartfusion®, is a highly preferred choice for users. mcu - 25, fpga - 66 is the I/O value of the product. 256-fpbga (17x17) is the supplier device package value. It has typical 16 weeks of manufacturer standard lead time. In addition, tray is the available packaging type of the product. It provides connectivity solutions through ebi/emi, ethernet, i²c, spi, uart/usart. The product has -40°c ~ 100°c (tj) operating temperature range. The product has been designed as mcu, fpga. Moreover, the product comes in 256-lbga. It has supplied with other peripherals, such as dma, por, wdt. The product has typical 64kb RAM size. It has a robust speed of 80mhz. The product has 256kb flash size.
Mult Dev Design Advisory 13/Oct/2017(PCN Design/Specification)
Mult Dev Software Chg 8/Oct/2018(PCN Design/Specification)
Mult Devices 29/Mar/2019(PCN Assembly/Origin)
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This is manufactured by Microsemi Corporation. The manufacturer part number is A2F200M3F-FGG256I. Primary Attributes of the Product: proasic®3 fpga, 200k gates, 4608 d-flip-flops. The microsemi corporation's product offers user-desired applications. It features arm® cortex®-m3 system on chip (soc) ic smartfusion® proasic®3 fpga, 200k gates, 4608 d-flip-flops 80mhz 256-fpbga (17x17). arm® cortex®-m3 is the product's core processor. Base Part Number: a2f200. The product smartfusion®, is a highly preferred choice for users. mcu - 25, fpga - 66 is the I/O value of the product. 256-fpbga (17x17) is the supplier device package value. It has typical 16 weeks of manufacturer standard lead time. In addition, tray is the available packaging type of the product. It provides connectivity solutions through ebi/emi, ethernet, i²c, spi, uart/usart. The product has -40°c ~ 100°c (tj) operating temperature range. The product has been designed as mcu, fpga. Moreover, the product comes in 256-lbga. It has supplied with other peripherals, such as dma, por, wdt. The product has typical 64kb RAM size. It has a robust speed of 80mhz. The product has 256kb flash size.
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Don’t hesitate to ask questions for better clarification.