Texas Instruments DAC6578SRGET

DAC6578SRGET Texas Instruments
Texas Instruments

Product Information

Differential Output:
No
HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Number of D/A Converters:
8
Operating Temperature:
-40°C ~ 125°C
Package / Case:
24-VFQFN Exposed Pad
Number of Bits:
10
REACH Status:
REACH Unaffected
Output Type:
Voltage - Buffered
edacadModel:
DAC6578SRGET Models
edacadModelUrl:
/en/models/2360830
Reference Type:
External
Voltage - Supply, Analog:
2.7V ~ 5.5V
Settling Time:
12µs (Typ)
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Architecture:
String DAC
standardLeadTime:
6 Weeks
INL/DNL (LSB):
±0.06, ±0.03
Mounting Type:
Surface Mount
Data Interface:
I2C
Series:
-
Supplier Device Package:
24-VQFN (4x4)
Voltage - Supply, Digital:
2.7V ~ 5.5V
Base Product Number:
DAC6578
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is DAC6578SRGET. Differential Output Info: no. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. It consists of 8 D/A converters. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 24-vfqfn exposed pad. The product consists of 10 bits. In addition, it is reach unaffected. Furthermore, it has avoltage - buffered output. The product has a reference of external type. The analogue voltage supply of the product is 2.7v ~ 5.5v. Features 12µs (typ) settling time. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 3 (168 hours). The product has been designed as string dac. It has a long 6 weeks standard lead time. INL/DNL (LSB) Specifications: ±0.06, ±0.03. The product is available in surface mount configuration. It acts as a i2c data interface. 24-vqfn (4x4) is the supplier device package value. While the digital voltage supply includes 2.7v ~ 5.5v. Moreover, it corresponds to dac6578, a base product number of the product. The product is designated with the ear99 code number.

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Wafer Fab Site 18/Apr/2017(PCN Assembly/Origin)
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Mult Dev Material Chg 29/Mar/2018(PCN Design/Specification)

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