Texas Instruments LM2901AVQPWRQ1

LM2901AVQPWRQ1 Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Current - Input Bias (Max):
0.25µA @ 5V
Current - Quiescent (Max):
2.5mA
Operating Temperature:
-40°C ~ 125°C
Voltage - Supply, Single/Dual (±):
2V ~ 36V, ±1V ~ 18V
Package / Case:
14-TSSOP (0.173", 4.40mm Width)
Type:
General Purpose
Propagation Delay (Max):
-
REACH Status:
REACH Unaffected
Output Type:
Open-Collector
Hysteresis:
-
edacadModel:
LM2901AVQPWRQ1 Models
edacadModelUrl:
/en/models/1510032
CMRR, PSRR (Typ):
-
Package:
Tape & Reel (TR)
Voltage - Input Offset (Max):
2mV @ 5V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Output (Typ):
20mA
Qualification:
AEC-Q100
standardLeadTime:
6 Weeks
Mounting Type:
Surface Mount
Grade:
Automotive
Series:
-
Supplier Device Package:
14-TSSOP
Number of Elements:
4
Base Product Number:
LM2901
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LM2901AVQPWRQ1. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The maximum input bias current includes 0.25µa @ 5v. It has a maximum quiescent current of 2.5ma. The product has -40°c ~ 125°c operating temperature range. It features a typical 2v ~ 36v, ±1v ~ 18v voltage of single or dual. Moreover, the product comes in 14-tssop (0.173", 4.40mm width). It comes in general purpose configuration. In addition, it is reach unaffected. Furthermore, it has aopen-collector output. It is shipped in tape & reel (tr) package . The maximum input offset voltage of 2mv @ 5v. Its typical moisture sensitivity level is 1 (unlimited). Features a typical output current of 20ma. It has a long 6 weeks standard lead time. The product is available in surface mount configuration. The product is automotive, a grade of class. 14-tssop is the supplier device package value. It carries 4 elements. Moreover, it corresponds to lm2901, a base product number of the product. The product is designated with the ear99 code number.

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New Assembly Materials 02/Nov/2016(PCN Design/Specification)
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Mult Dev Assembly Wafer Site/Design 21/Dec/2023(PCN Design/Specification)
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Symbolization Update 28/Nov/2022(PCN Packaging)

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