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This is manufactured by onsemi. The manufacturer part number is FDG6321C. The given dimensions of the product include 2.2 x 1.35 x 1mm. The product is available in surface mount configuration. Provides up to 300 mw maximum power dissipation. The package is a sort of sc-70. It consists of 2 elements per chip. It has a maximum operating temperature of +150 °c. It contains 6 pins. The FET features of the product include logic level gate. It is assigned with possible HTSUS value of 8541.21.0095. The product is rohs3 compliant. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 6-tssop, sc-88, sot-363. It has a maximum Rds On and voltage of 450mohm @ 500ma, 4.5v. The typical Vgs (th) (max) of the product is 1.5v @ 250µa. In addition, it is reach unaffected. The continuous current drain at 25°C is 500ma, 410ma. The product is available in n and p-channel configuration. The onsemi's product offers user-desired applications. The product has a 25v drain to source voltage. Its typical moisture sensitivity level is 1 (unlimited). It has a long 10 weeks standard lead time. The product's input capacitance at maximum includes 50pf @ 10v. The maximum gate charge and given voltages include 2.3nc @ 4.5v. sc-88 (sc-70-6) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. The maximum power of the product is 300mw. This product use mosfet (metal oxide) technology. Moreover, it corresponds to fdg6321, a base product number of the product. The product is designated with the ear99 code number.
For more information please check the datasheets.
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