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United Kingdom
Double-Sided, Non-Allocated Motherboards Complete flexibility of positioning of Vdc or earthing. Four voltage lines available. Option to connect power supply using 6.3 mm terminal type faston or M3 thread. Choice of various widths and pitches of connectors. Row b can be used as a 0 V reserve line, in order to minimise crosstalk on rows a and c. Contacts 1, 2, 31 and 32 are allocated via a 2.54 mm pitch connection. Other contacts can be allocated by wiring or wrapping. Rows a, b and c can be connected together using strap connectors (designed to connect DIN connector pins). Boards feature high-quality foil laminate holes with varnish to avoid solder bridges. Material: epoxy glass in accordance with BS 4584 EP-GC-CU-3 (FR4) Nominal thickness: 1.6 mm Track thickness: 35 μm Coating: - copper: 25 μm - tin plating: 8 μm Self-extinguishing capability (empty board): UL 94-V0 Stock type Pitch number Length width no. connectors (mm) of positions (mm) (mm) 110-2523 96 / 96 20.32 21 420.8 128.6 110-2539 96 / 96 20.32 10 212.5 128.6 110-2545 96 / 96 20.32 5 95.7 128.6 156-7885 96 / 96 15.24 28 425.9 128.6 508-0893 96 / 96 15.24 14 212.5 128.6 PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.
For more information please check the datasheets.
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