The Dexter Corporation

Polyamide Hot Melt Glue Excellent gap filling performance Low temperature flexibility Shock and heat resistance Easy to apply and fast fixing UL94V-0 Rating Low Viscosity: Typical uses - wire staking, cable terminal encapsulation. Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun. Low temperature flexibility and excellent impact resistance Ideal where substrates may be exposed to temperature extremes Elastomeric (elongation 900%) Can also be used to bond PC board Tough, flexible adhesive with excellent adhesion Tensile strength, 600PSI Compatibility table Description Paper & Card Wood Plastic Sheet Metals Expanded polystyrene Polyurethane foam Glass & Ceramic Gap filling Open time (secs) Stock numbers Multi-purpose sticks & slugs yes yes some yes yes yes no yes 45 484-9950, 315-2716 High performance sticks & slugs yes yes some yes yes yes yes no 45 484-9900, 692-413 Very high performance slugs yes yes most yes yes yes yes no 30 315-2750 Fast set packaging sticks & slugs yes no no no yes no no no 15 484-9966, 315-2744 General Purpose sticks (coloured & clear) yes no no no yes yes yes yes 15 484-9988, 315-2772, 315-2788, 315-2794, 315-2801, 315-2817, 315-2823, 315-2839 Low Melt sticks yes yes no some yes no no no 35 692-441 Polyamide sticks, Low Viscosity yes yes some yes yes - - yes - 217-9322 Polyamide sticks, Fire retardent yes yes some yes yes - - yes - 217-9344 Polyamide sticks, High Viscosity yes yes some yes yes - - yes - 217-9316 Potting/encapsulating sticks n/a n/a n/a n/a n/a n/a n/a no 60 448-6830 Note: This table should be used as a guide only. It is strongly recommended that users conduct their own tests to determine suitability.

Polyamide Hot Melt Glue Excellent gap filling performance Low temperature flexibility Shock and heat resistance Easy to apply and fast fixing UL94V-0 Rating Low Viscosity: Typical uses - wire staking, cable terminal encapsulation. Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun. Low temperature flexibility and excellent impact resistance Ideal where substrates may be exposed to temperature extremes Elastomeric (elongation 900%) Can also be used to bond PC board Tough, flexible adhesive with excellent adhesion Tensile strength, 600PSI Compatibility table Description Paper & Card Wood Plastic Sheet Metals Expanded polystyrene Polyurethane foam Glass & Ceramic Gap filling Open time (secs) Stock numbers Multi-purpose sticks & slugs yes yes some yes yes yes no yes 45 484-9950, 315-2716 High performance sticks & slugs yes yes some yes yes yes yes no 45 484-9900, 692-413 Very high performance slugs yes yes most yes yes yes yes no 30 315-2750 Fast set packaging sticks & slugs yes no no no yes no no no 15 484-9966, 315-2744 General Purpose sticks (coloured & clear) yes no no no yes yes yes yes 15 484-9988, 315-2772, 315-2788, 315-2794, 315-2801, 315-2817, 315-2823, 315-2839 Low Melt sticks yes yes no some yes no no no 35 692-441 Polyamide sticks, Low Viscosity yes yes some yes yes - - yes - 217-9322 Polyamide sticks, Fire retardent yes yes some yes yes - - yes - 217-9344 Polyamide sticks, High Viscosity yes yes some yes yes - - yes - 217-9316 Potting/encapsulating sticks n/a n/a n/a n/a n/a n/a n/a no 60 448-6830 Note: This table should be used as a guide only. It is strongly recommended that users conduct their own tests to determine suitability.