The TGlobal Ultra Soft Thermal Pad is a high-performance thermal interface material designed for high-power electronic applications. It features high thermal conductivity, making it ideal for efficient heat dissipation in various electronic components. This thermal pad is suitable for use in a wide range of industries, including 5G, aerospace, AI, AIoT, AR/VR/MR/XR, automotive, consumer devices, Datacom, electric vehicles, electronic products, energy storage, industrial equipment, lighting, medical devices, military applications, Netcom, panels, power electronics, robotics, servers, smart home technologies, and telecommunications.
High compressibility
Natural tack
REACH compliant
RoHS compliant
UL compliant
