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New Items
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0603Y0250223KXT, Syfer Technology

0603Y0250223KXT, Syfer Technology

Syfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
New items
1206Y5000223KXT, Syfer Technology

1206Y5000223KXT, Syfer Technology

Syfer Flexicap 1206 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes 1206 Range C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
New items
1808YA250102JXTSPU, Syfer Technology

1808YA250102JXTSPU, Syfer Technology

Syfer 250Vac Y3/X2 Safety Certified Surge Protection (SP) range of ceramic chip capacitors are Class Y3/X2 compliant and designed specifically for use in equipment certified to IEC 60950 Suitable for modems, faxes, telephones and other electronic equipment where over voltage surges can occur - i.e. a lightning strike This range of capacitors is approved and certified by TÜV certificate numbers R2110618 for C0G and R60003323 for X7R. These multilayer chip capacitors meet the electrical requirements of IEC 60384-14 and EN 132400, and the electrical specification and creepage limitations of IEC 60950 AC rated Multilayer Ceramic
New items
0603Y1000221KXT, Syfer Technology

0603Y1000221KXT, Syfer Technology

Syfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
New items
1206Y0500102JXT, Syfer Technology

1206Y0500102JXT, Syfer Technology

Syfer Flexicap 1206 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes 1206 Range C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
New items
1210Y2000222JCT, Syfer Technology

1210Y2000222JCT, Syfer Technology

Syfer Flexicap 1210 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
New items
1812Y2K00222KXT, Syfer Technology

1812Y2K00222KXT, Syfer Technology

Syfer Flexicap 1812 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes Note Sorted in order of dielectric, voltage then capacitance.
New items
0603Y2000471KXT, Syfer Technology

0603Y2000471KXT, Syfer Technology

Syfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
New items
1206Y0500122JCT, Syfer Technology

1206Y0500122JCT, Syfer Technology

Syfer Flexicap 1206 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes 1206 Range C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
New items
0603Y0500223KXT, Syfer Technology

0603Y0500223KXT, Syfer Technology

Syfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
New items
0603Y1000151KXT, Syfer Technology

0603Y1000151KXT, Syfer Technology

Syfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
New items
1206Y1000220KCT, Syfer Technology

1206Y1000220KCT, Syfer Technology

Syfer Flexicap 1206 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes 1206 Range C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications